81EPON828D_TDS-2.pdf
Technical Data Sheet
Re-issued September 2005
EPON Resin 828
Product Description
EPON Resin 828 is an undiluted clear difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin.
When cross-linked or hardened with appropriate curing agents, very good mechanical, adhesive, dielectric
and chemical resistance properties are obtained. Because of this versatility, EPON Resin 828 has become
a standard epoxy resin used in formulation, fabrication and fusion technology.
Benefits
Fiber reinforced pipes, tanks and composites
Tooling, casting and molding compounds
Construction, electrical and aerospace adhesives
High solids/low VOC maintenance and marine coatings
Electrical encapsulations and laminates
Chemical resistant tank linings, flooring and grouts
Base resin for epoxy fusion technology
Sales Specification
Typical Properties
Property Units Value Test Method/Standard
Weight per Epoxide g/eq 185 192 ASTM D1652
Viscosity at 25 C P 110 150 ASTM D445
Color Gardner 1 max. ASTM D1544
Property Units Value Test Method/Standard
Density at 25 C lb/gal 9.7 ASTM D1475
Denisty at 25 C g/ml 1.16
Vapor pressure @ 25 C (77
F)
mm Hg 0.03
Refractive index @ 25 C (77
F)
1.573
Specific heat BTU/lb/ F 0.5
Page 1 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
Processing/How to use
General Information
The low viscosity and cure properties of EPON Resin 828 allow its use under various application and
fabrication techniques including:
Curing Agents
EPON Resin 828 can be cured or cross
-linked with a variety of curing agents depending on properties
desired in the finished product and the processing conditions employed. Some commonly used curing
agents, recommended concentrations, typical cure schedules employed in major end-use applications, plus
sources for these curing agents are displayed in Table 1.
Performance Properties
Perfomance Characteristics of Cured EPON Resin 828
Mechanical Properties
High performance, high strength materials are obtained when this resin is cured with a variety of curing
agents. Unfilled systems in common use have tensile values greater than 10,000 psi (69 MPa) with modulus
values greater than 400,000 psi (2750 MPa). Such systems are normally very rigid. If greater flexibility is
needed systems can be formulated to provide up to 300% elongation.
Adhesive Properties
One of the most widely recognized properties of cured EPON Resin 828 is strong adhesion to a broad
range of substrates. Such systems exhibit shear strength of up to 6,000 psi (41 Mpa). One factor which
contributes to this property is the low shrinkage shown by these systems during cure. Compared to other
polymers, epoxy resins have low internal stresses resulting in strong and durable finished products.
Electrical Properties
EPON Resin 828 cured systems have very good electrical insulating characteristics and dielectric
properties. For example, systems can be obtained with anhydride and amine curing agents having volume
resistivities up to 1 x 10E16 ohm-cm, dielectric constants of 3-5 and dissipation factors of 0.002 to 0.020 at
ambient conditions. Electrical encapsulations, laminates and molding compounds are frequently based on
EPON Resin 828.
Chemical Resistance
Cured EPON Resin 828 is highly resistant to a broad range of chemicals, including caustic, acids, fuels and
solvents. Chemically resistant reinforced structures and linings or coatings over metal can be formulated
with EPON Resin 828.
Formulating Techniques
The primary components of a thermosetting resin formula are the epoxy resin and the hardener or curing
Spraying and brushing Pultrusion
Filament winding Casting
Pressure laminating Molding
Vacuum bag laminating Toweling
EPON Resin 828
Page 2 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
agent. However, in practice other materials are normally incorporated to achieve special properties. For
example, inert fillers such as silicas, talcs, calcium silicates, micas, clays and calcium carbonate can be
added to further reduce shrinkage and improve dimensional stability. Also, reactive diluents can be added
to EPON Resin 828 to reduce viscosity. The effect on viscosity by adding such materials is shown in Figure
1.
Table 1 / Curing Agents for EPON 828
Curing Agent
1
PhysicalState
RecommendedConcentration
Range, phr
2
Typical
Cure
Schedule
Time
C ( F)
Deflection
Temperature
3
C ( F)
Applications
4
Suppliers
5
Aliphatic Amines
EPIKURE 3223
(DETA)
Liquid 12 7d, 25
(77)
120(250) ABCDEFHI 5
EPIKURE 3234
(TETA)
Liquid 13 7d, 25
(77)
120(250) ABCDEFHI 5
EPIKURE 3200 (AEP) Liquid 22 24h, 25
(77) &
1h, 150
(300)
120(250) BCEFGH 5
EPIKURE 3270 Liquid 75 14d, 25
(77)
56(133) ABCDEFHI 5
EPIKURE 3271 Liquid 18 14d, 25
(77)
66(151) ABCDEFHI 5
EPIKURE 3274 Liquid 40 14d, 25
(77)
— ABCDEFHI 5
EPIKURE 3230 Liquid 35 7d, 25
(77)
68(155) ABCDEFHI 1
D-400 Type PEA Liquid 55 30 min,
115(240)
31(88) ABCEFH 1
Cycloaliphatic Amines
EPIKURE 3370 Liquid 38 7d, 25
(77)
56(133) ABCDEFHI 5
EPIKURE 3382 Liquid 63 7d, 25
(77)
63(145) ABCDEFHI 5
EPIKURE 3383 Liquid 60 24h, 25
(77) &
2h, 100
(212)
54(129) ABCDEFHI 5
EPON Resin 828
Page 3 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
Table 1 / Curing Agents for EPON 828, cont.
Polyamides
EPIKURE 3115 Liquid 120 1h, 100
(212)
85(185) AB 5
EPIKURE 3125 Liquid 90 7d, 25
(77)
90(195) ABCEFH 5
EPIKURE 3140 Liquid 75 7d, 25
(77)
115(240) ABCEFH 5
Amindoamines
EPIKURE 3015 Liquid 50 16h, 25
(77) &
2h, 93
(200)
— ABCDEFHI 5
EPIKURE 3055 Liquid 50 16h, 25
(77) &
2h, 93
(200)
67(153) ABCDEFHI 5
EPIKURE 3072 Liquid 35 14d, 25
(77)
59(138) ABCDEFHI 5
Aromatic Amines
EPIKURE W Liquid 5
Metaphenylenediamine
(MPDA)
Solid 14 2h, 80
(175) &
2h, 150
(300)
150(300) BCDGHI 3
Methylene dianiline
(MDA)
Solid 27 2h, 80
(175) &
2h, 150
(300)
160(320) BCDEGHI 13
Diaminodiphenyl
Sulfone (DADS)
Solid 25 5h, 125
(257) &
1h, 200
(392)
170(350) BCDGHI 2, 13
Curing Agent
1
PhysicalState
RecommendedConcentration
Range, phr
2
Typical
Cure
Schedule
Time
Deflection
Temperature
3
C ( F)
Applications
4
Suppliers
5
EPON Resin 828
Page 4 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
1
Cures can be effected
with these curing agents over a wide range of temperatures. Higher temperatures
yield shorter cure times and highest Tg.
2
Parts of curing agent per 100 parts of resin.
3
Systems cured at room temperature were post cured at elevated temperature to achieve deflection values.
4
Application codes: A
– Coatings; B – Adhesives; C – Castings; D – Moldings; E – Flooring; F – Paving; G –
Electrical Laminates; H
– Structural Laminates; I-Filament Winding.
5
Supplier Code:
1. Huntsman Chemical
2. RSA Corporation
3. E.I. DuPont de Nemours &Co., Chemicals & Pigments Dept.
4. Harshaw Chemical Company
5. Hexion Specialty Chemical
6. BASF Corporation
7. American Cyanamid
– Industrial Chemical Div.
8. Milliken & Company
C ( F)
Anhydrides
Methyl tetrahydrophthalic
Anhydride (MTHPA)
Liquid 80 2h, 120
(250) &
2h, 150
(300)
130(266) BCDGHI 9, 11, 14
NADIC Methyl
Anhydride (NMA)
Liquid 90 1h, 120
(250) &
2
-24h,
260(500)
180(356) BCDGHI 9, 14
Hexahydrophthalic
Anhydride (HHPA)
Solid 80 1h, 80
(175) &
2h, 150
(300)
130(265) BCDGHI 8, 12, 14
Catalysts and
Miscellaneous
2-Ethyl- 4-Methyl
Imidazole (EMI-24)
Metastable
Liquid
3 4h, 50
(122) &
2h, 170
(340)
170(340) BCDGHI 15, 16
BF3-Monoethylamine
(BF3
-MEA)
Liquid 3 1h, 120
(250) &
2h, 170
(340)
170(340) BCDGHI 17
Diethylaminopropylamine
6
Solid 6 30 min,
115(240)
100(212) ABC 6
Dicyandiamide Solid 4 1h, 177
(350)
150(300) BCDGHI 18, 19
EPON Resin 828
Page 5 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
9. Lindau Chemicals, Inc.
10. Anhydrides and Chemicals, Inc.
11. Dixie Chemical Co., Inc.
12. Buffalo Color Corp.
13. Air Products and Chemicals, Inc.
14. Lonza
15. Interchem
16. Polyorganix
17. Atotech
18. SKW Trotsbery
19. Ashland Chemical
6
Dimethylamino propylamine may be substituted at expense of slightly reduced pot life. Sources are 2 and
16.
Figure 1 / Viscosity at 25 C of EPON Resin 828 blends with various diluents
Fusion Technology
EPON Resin 828 is the product of choice for a resin chemist using a specific fusion catalyst when
processing proprietary solid epoxy resins or epoxy esters. Upon request, Hexion can provide EPON Resin
828 exhibiting extremely low hydrolyzable and total chlorine, two end groups that may be deleterious to resin
curing and long term performance in electrical uses.
FDA Status
Provisions are made in the FDA regulations for the use of EPON Resin 828, when properly formulated,
applied and cured, for food contact applications under Title 21 Code of Federal Regulations 175.300. The
regulations should be consulted for complete details. In particular, we direct your attention to subparagraph
(b) of 21 CFR 174.5 and the general provisions applicable to indirect food additives listed there.
Identification and Classification
EPON Resin 828
Page 6 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
Chemical Abstract Service Registry Number: 25068 -38-6 (EPA/TSCA inventory designation)
Generic name: Liquid Bisphenol A Epichlorohydrin based epoxy resin.
Chemical designation:
Phenol, 4,4O – (1-methylethylidene) bis-polymer with (chloromethyl) oxirane.
Figure 2 / Viscosity
– temperature profile for EPON Resin 828
Figure 3 / Specific gravity
– temperature profile for EPON Resin 828
EPON Resin 828
Page 7 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
Formulation and Application Information
For additional performance characteristics information covering adhesives, laminating, casting and molding
applications, consult bulletin SC:67, entitled “EPON Resin Structural Reference Manual.” For epoxy resin
amine-cured coatings, consult bulletin SC:193, entitled “Formulating Amine-Cured Coatings with EPON
Resin.”
Figure 4 / Viscosity
– temperature profile (for 5 samples of EPON Resin 828 ranging in viscosity
from 110
-150 poise)
Safety, Storage & Handling
Please refer to the MSDS for the most current Safety and Handling information.
Please refer to the Hexion web site for Shelf Life and recommended Storage information.
EPON Resin 828 is an undiluted liquid epoxy resin that is available in tank cars, tank trucks and 500 pound
net closed head drums. EPON Resin 828 is normally shipped in bulk from 150 F (66 C) to 180 F (82 C)
and can be stored at 120
-140 F (49-60 C) for ease of handling. The viscosity/temperature profile and the
specific gravity/temperature profile for EPON Resin 828 are displayed in Figures 2 and 3 respectively for
your guidance.
NOTE OF CAUTION:
When checking viscosity of EPON Resin 828 incoming samples, we caution you to
make certain that the product is maintained at 25 +/- 0.01 C before testing. You will note in Figure 4 that
EPON Resin 828 can vary in viscosity by 10-15 poise for each degree in temperature the product varies
from 25 C.
Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper
precautions, use of appropriate engineering controls and proper personal protective clothing and
equipment, and adherence to proper handling procedures. None of these materials should be used,
stored, or transported until the handling precautions and recommendations as stated in the
Material Safety Data Sheet (MSDS) for these and all other products being used are understood by
all persons who will work with them.
Questions and requests for information on Hexion Inc. (“Hexion”)
EPON Resin 828
Page 8 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
products should be directed to your Hexion sales representative, or the nearest Hexion sales office.
Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.
Packaging
Available in bulk and drum quantities.
Contact Information
For product prices, availability, or order placement, call our toll-free customer service number at:
1
-877-859-2800
For literature and technical assistance, visit our website at:
www.hexion.com
and Licensed trademarks of Hexion Inc.
DISCLAIMER
The information provided herein was believed by Hexion Inc. (
Hexion ) to be accurate at the time of preparation or prepared from sources believed to be
reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures
applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion
are subject to Hexion
s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE
MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION ,
except that the product shall conform to Hexion
s specifications. Nothing contained herein constitutes an offer for the sale of any product.
PDS
-3942- (Rev.3/6/2015 11:22:27 AM)
EPON Resin 828
Page 9 of 9HCD-3942 (Rev. 3/6/2015 11:22:28 AM)
81ERCCS6_TDS.pdf
ENTROPY
RESINS
Clear Casting System
Clear, Low Viscosity Liquid Epoxy Resin for
Casting, Potting, and Embedding
CCR is a water-clear, UV stabilized, low-viscosity epoxy system designed
specifically for casting, potting, and embedding applications. Low color and
low viscosity allow for bubble-free, crystal clear casting ideal for art and
hobby applications.
The system features two hardener speeds: slow (CCS) for high build casting
resin applications and fast (CCF) for quick, small project fast casting resin
applications such as resin jewelry and more. CCR is a USDA Certified
BioPreferred@ Product with 30% biobased content.
–
Tensile Modulus (ASTM D638) 448,0O0 psi (3.1 GPa) 440,850 psi (3.0 GPa)
Tssile Strssih (AsTM D638) 8,140 psi(56.1 MPa) 7,910 psi (54,5 MPa)
Elongatlon (ASTM D638) 6% 6.5
Flqural Modulus (ASTM D790) 390,000 psi (2.7 GPa) 409,670 psi (2.8 GPa)
Flqural Strength (ASTM D790) 11,850 psi(81.7 (MPa) 11,100 psi (76.5 MPa)
compresion Strffgth (ASTM D695) 12,380 psi (85.4 MPa) 1O,860 psi (74.9 MPa)
T8 Ultlmte (DSC, midpoint) 723″F/51″C 727″F/52″C
Hardnes (Shore D) 70-80 70-80
Mix Ratl,o (by volume) 2i7 2tl
Mlx Retlo (by weight) 10O:43 7OO:42
Viscoslty (A/B/Mixed @ 77’F/25″C1 2t60/so/370 2760/15/270
Comporent Dsslty (specific density @ 77″F/25″C1 1.13 (resin), 0.98 (hardener) 1.13 (resin), 0.95 (hardener)
Mlxed Dmlty (specific density @ 77’Fl25’C) 1.08 7.O7
PotLllel@77″F/25″C 90 min 360 min
Tack Fre Tlre (@ 95″F/35″C) 24 hts 72 hrs
Rcommoded Full Cure 7 days@77’F/25″C,
Post cure recommended
7 days@77″F/25″c,
Post cure recommended
VOCContst (AsTM D2369) O.OB lbs/eal19.2 elLl 0.07 lbs/gal (8.0 g/L)
Mixed Biobased carbon Content (ASTM D6866) 20% 200/6
This technical information is provided in good faith and is based on the best knowledge of Gougeon Brothers, lnc. We cannot guarantee this data
because conditions of product use are beyond our control.
TDS revised May 2020. O Gougeon Brothers, lnc. 2020
SAP-
100 Patterson Ave., Bay City, Ml 48706
entropyresins.com
suPER0
FORMULATION
USDA
CERTIFIED
BIOAASED
PRODUCT
Wmf;frEn
81EPON828D_TDS-1.pdf
Technical Data Bulletin
EPON Resin 828
RP: 3075 Re-issued: September 2005
Introduction EPON Resin 828 is an undiluted clear difunctional bisphenol A/epichlorohydrin derived
liquid epoxy resin. When cross-linked or hardened with appropriate curing agents, very good
mechanical, adhesive, dielectric and chemical resistance properties are obtained. Because
of this versatility, EPON Resin 828 has become a standard epoxy resin used in formulation,
fabrication and fusion technology.
Features
Fiber reinforced pipes, tanks and composites
Tooling, casting and molding compounds
Construction, electrical and aerospace adhesives
High solids/low VOC maintenance and marine coatings
Electrical encapsulations and laminates
Chemical resistant tank linings, flooring and grouts
Base resin for epoxy fusion technology
Typical Properties Property Test Method Unit Value
Epoxide Equivalent Weight
1
ASTM D1652 g/eq 185-192
Viscosity @ 25 C
2
ASTM D445 P 110-150
Color ASTM D1544 Gardner 1 max.
Pounds per Gallon @ 25 C (77 F) lbs/gal 9.7
Density @ 25 C (77 F) g/ml 1.16
Physical form Clear liquid
Vapor pressure @ 77 C (170 F) mm Hg 0.03
Refractive index @ 25 C (77 F) 1.573
Specific heat BTU/lb/ F 0.5
1
ASTM D1652 (Epoxy Content of Epoxy Resins Perchloric Acid Method)
2
ASTM D445 (Kinematic Viscosity – Determinatin of the Viscosity of Liauids by Ubbelohde Viscometer).
RP: 3075 EPON Resin 828 Page 2
General Information The low viscosity and cure properties of EPON Resin 828 allow its use under various
application and fabrication techniques including:
Spraying and brushing Pultrusion
Filament winding Casting
Pressure laminating Molding
Vacuum bag laminating Toweling
Curing Agents EPON Resin 828 can be cured or cross-linked with a variety of curing agents depending on
properties desired in the finished product and the processing conditions employed. Some
commonly used curing agents, recommended concentrations, typical cure schedules
employed in major end-use applications, plus sources for these curing agents are displayed
in Table 1.
Perfomance
Characteristics
of Cured
EPON Resin 828
Mechanical Properties
High performance, high strength materials are obtained when this resin is cured with a
variety of curing agents. Unfilled systems in common use have tensile values greater than
10,000 psi (69 MPa) with modulus values greater than 400,000 psi (2750 MPa). Such systems
are normally very rigid. If greater flexibility is needed systems can be formulated to provide
up to 300% elongation.
Adhesive Properties
One of the most widely recognized properties of cured EPON Resin 828 is strong adhesion to
a broad range of substrates. Such systems exhibit shear strength of up to 6,000 psi (41 Mpa).
One factor which contributes to this property is the low shrinkage shown by these systems
during cure. Compared to other polymers, epoxy resins have low internal stresses resulting
in strong and durable finished products.
Electrical Properties
EPON Resin 828 cured systems have very good electrical insulating characteristics and
dielectric properties. For example, systems can be obtained with anhydride and amine curing
agents having volume resistivities up to 1 x 1016 ohm-cm, dielectric constants of 3-5 and
dissipation factors of 0.002 to 0.020 at ambient conditions. Electrical encapsulations,
laminates and molding compounds are frequently based on EPON Resin 828.
Chemical Resistance
Cured EPON Resin 828 is highly resistant to a broad range of chemicals, including caustic,
acids, fuels and solvents. Chemically resistant reinforced structures and linings or coatings
over metal can be formulated with EPON Resin 828.
Formulating Techniques
The primary components of a thermosetting resin formula are the epoxy resin and the
hardener or curing agent. However, in practice other materials are normally incorporated to
achieve special properties. For example, inert fillers such as silicas, talcs, calcium silicates,
micas, clays and calcium carbonate can be added to further reduce shrinkage and improve
dimensional stability. Also, reactive diluents can be added to EPON Resin 828 to reduce
viscosity. The effect on viscosity by adding such materials is shown in Figure 1.
RP: 3075 EPON Resin 828 Page 3
Table 1 / Curing Agents for EPON 828
Curing Agent
1
Physical State
Recommended
Concentration
range, phr
2
Typical Cure
Schedule
Time C ( F)
Deflection
Temperature
3
C ( F)
Applications
4
Suppliers
5
Aliphatic Amines
EPIKURE 3223 (DETA) Liquid 12 7d, 25(77) 120(250) ABCDEFHI 5
EPIKURE 3234 (TETA) Liquid 13 7d, 25(77) 120(250) ABCDEFHI 5
EPIKURE 3200 (AEP) Liquid 22 24h, 25(77) &
1h, 150(300)
120(250) BCEFGH 5
EPIKURE 3270 Liquid 75 14d, 25(77) 56(133) ABCDEFHI 5
EPIKURE 3271 Liquid 18 14d, 25(77) 66(151) ABCDEFHI 5
EPIKURE 3274 Liquid 40 14d, 25(77) — ABCDEFHI 5
EPIKURE 3230 Liquid 35 7d, 25(77) 68(155) ABCDEFHI 1
D-400 Type PEA Liquid 55 30 min, 115(240) 31(88) ABCEFH 1
Cycloaliphatic Amines
EPIKURE 3370 Liquid 38 7d, 25(77) 56(133) ABCDEFHI 5
EPIKURE 3382 Liquid 63 7d, 25(77) 63(145) ABCDEFHI 5
EPIKURE 3383 Liquid 60 24h, 25(77) &
2h, 100(212)
54(129) ABCDEFHI 5
Polyamides
EPIKURE 3115 Liquid 120 1h, 100(212) 85(185) AB 5
EPIKURE 3125 Liquid 90 7d, 25(77) 90(195) ABCEFH 5
EPIKURE 3140 Liquid 75 7d, 25(77) 115(240) ABCEFH 5
Amindoamines
EPIKURE 3015 Liquid 50 16h, 25(77) &
2h, 93(200)
— ABCDEFHI 5
EPIKURE 3055 Liquid 50 16h, 25(77) &
2h, 93(200)
67(153) ABCDEFHI 5
EPIKURE 3072 Liquid 35 14d, 25(77) 59(138) ABCDEFHI 5
Aromatic Amines
EPIKURE W Liquid 5
Metaphenylenediamine
(MPDA)
Solid 14 2h, 80(175) &
2h, 150(300)
150(300) BCDGHI 3
Methylene dianiline
(MDA)
Solid 27 2h, 80(175) &
2h, 150(300)
160(320) BCDEGHI 13
Diaminodiphenyl
Sulfone (DADS)
Solid 25 5h, 125(257) &
1h, 200(392)
170(350) BCDGHI 2, 13
RP: 3075 EPON Resin 828 Page 4
Table 1 / Curing Agents for EPON 828 (cont.)
Curing Agent
1
Physical State
Recommended
Concentration
range, phr
2
Typical Cure
Schedule
Time C ( F)
Deflection
Temperature
3
C ( F)
Applications
4
Suppliers
5
Anhydrides
Methyl tetrahydrophthalic
Anhydride (MTHPA)
Liquid 80 2h, 120(250) &
2h, 150(300)
130(266) BCDGHI 9, 11, 14
NADIC Methyl
Anhydride (NMA)
Liquid 90 1h, 120(250) &
2-24h, 260(500)
180(356) BCDGHI 9, 14
Hexahydrophthalic
Anhydride (HHPA)
Solid 80 1h, 80(175) &
2h, 150(300)
130(265) BCDGHI 8, 12, 14
Catalysts and
Miscellaneous
2-Ethyl- 4-Methyl Imidazole
(EMI-24)
Metastable
Liquid
3 4h, 50(122) &
2h, 170(340)
170(340) BCDGHI 15, 16
BF3-Monoethylamine
(BF3-MEA)
Liquid 3 1h, 120(250) &
2h, 170(340)
170(340) BCDGHI 17
Diethylaminopropylamine
6
Solid 6 30 min, 115(240) 100(212) ABC 6
Dicyandiamide Solid 4 1h, 177(350) 150(300) BCDGHI 18, 19
1
Cures can be effected with these curing agents over a wide range of temperatures. Higher temperatures yield shorter cure times and highest Tg.
2
Parts of curing agent per 100 parts of resin.
3
Systems cured at room temperature were post cured at elevated temperature to achieve deflection values.
4
Application codes: A – Coatings; B – Adhesives; C – Castings; D – Moldings; E – Flooring; F – Paving; G – Electrical Laminates; H – Structural Laminates; I-Filament
Winding.
5
Supplier Code:
1. Huntsman Chemical
2. RSA Corporation
3. E.I. DuPont de Nemours & Co., Chemicals & Pigments Dept.
4. Harshaw Chemical Company
5. Hexion Specialty Chemical
6. BASF Corporation
7. American Cyanamid – Industrial Chemical Div.
8. Milliken & Company
9. Lindau Chemicals, Inc.
10. Anhydrides and Chemicals, Inc.
11. Dixie Chemical Co., Inc.
12. Buffalo Color Corp.
13. Air Products and Chemicals, Inc.
14. Lonza
15. Interchem
16. Polyorganix
17. Atotech
18. SKW Trotsbery
19. Ashland Chemical
6
Dimethylamino propylamine may be substituted at expense of slightly reduced pot life. Sources are 2 and 16.
RP: 3075 EPON Resin 828 Page 5
Figure 1 / Viscosity at 25 C of EPON Resin 828 blends with various diluents
Fusion Technology EPON Resin 828 is the product of choice for a resin chemist using a specific fusion catalyst
when processing proprietary solid epoxy resins or epoxy esters. Upon request, Hexion
Specialty Chemicals can provide EPON Resin 828 exhibiting extremely low hydrolyzable and
total chlorine, two end groups that may be deleterious to resin curing and long term
performance in electrical uses.
FDA Status Provisions are made in the FDA regulations for the use of EPON Resin 828, when properly
formulated, applied and cured, for food contact applications under Title 21 Code of Federal
Regulations 175.300. The regulations should be consulted for complete details. In particular,
we direct your attention to subparagraph (b) of 21 CFR 174.5 and the general provisions
applicable to indirect food additives listed there.
Identification and
Classification
Chemical Abstract Service Registry Number: 25068-38-6 (EPA/TSCA inventory designation)
Generic name: Liquid Bisphenol A Epichlorohydrin based epoxy resin.
Chemical designation: Phenol, 4,4O – (1-methylethylidene) bis-polymer with (chloromethyl)
oxirane.
RP: 3075 EPON Resin 828 Page 6
Figure 2 / Viscosity – temperature profile for EPON Resin 828
Viscosity, cP
10,000
1,000
100
10
70 80 90 100 110 120 130 140 150 160 170 180 190
(27) (32) (38) (43) (49) (54) (60) (65.5) (71) (77) (82) (88)
Temperature, F ( C)
Figure 3 / Specific gravity – temperature profile for EPON Resin 828
RP: 3075 EPON Resin 828 Page 7
Formulation and
Application
Information
For additional performance characteristics information covering adhesives, laminating,
casting and molding applications, consult bulletin SC:67, entitled “EPON Resin Structural
Reference Manual.” For epoxy resin amine-cured coatings, consult bulletin SC:193, entitled
“Formulating Amine-Cured Coatings with EPON Resin.”
Figure 4 / Viscosity – temperature profile (for 5 samples of EPON Resin 828
ranging in viscosity from 110-150 poise)
Packaging and
Storage
EPON Resin 828 is an undiluted liquid epoxy resin that is available in tank cars, tank trucks
and 500 pound net closed head drums. EPON Resin 828 is normally shipped in bulk from 150
F (66 C) to 180 F (82 C) and can be stored at 120-140 F (49-60 C) for ease of handling. The
viscosity/temperature profile and the specific gravity/temperature profile for EPON Resin 828
are displayed in Figures 2 and 3 respectively for your guidance.
EPON Resin 828 is susceptible to crystallization upon prolonged storage at normal ambient
temperatures. It may be reconstituted by warming to 120-140 F for 4-24 hours depending on
the mass involved.
NOTE OF CAUTION: When checking viscosity of EPON Resin 828 incoming samples, we
caution you to make certain that the product is maintained at 25 +/- 0.01 C before testing.
You will note in Figure 4 that EPON Resin 828 can vary in viscosity by 10-15 poise for each
degree in temperature the product varies from 25 C.
According to the Department of Transportation regulations (Code of Federal Regulations,
Title 49), EPON Resin 828 is not classified or regulated as a flammable or combustible
material. No special labeling is required for transportation.
For more storage information, please visit the Shelf Life section of our website at:
www.hexion.com
For product prices, availability, or order placement,
call our toll-free customer service number at:
1-877-859-2800
For sales in North and South America outside the United States, call:
1-832-366-2365
For literature and technical assistance, visit our website at:
www.hexion.com
SAFETY & HANDLING
These products are capable of producing adverse health effects ranging from minor skin irritation to
serious systemic effects. Exposure to these materials should be minimized and avoided, if feasible,
through the observance of proper precautions, use of appropriate engineering controls, and proper
personal protective clothing and equipment, and adherence to proper handling procedures. None of
these materials should be used, stored, or transported until the handling precautions and
recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other
products being used are understood by all persons who will work with them. Questions and
requests for information on Hexion Specialty Chemicals, Inc. (“Hexion”) products should be directed to
your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-
Hexion products should be obtained from the respective manufacturer.
Hexion Specialty Chemicals, Inc.
PO Box 4500
Houston, TX 77210-4500
For worldwide locations visit
hexionchem.com
2005 Hexion Specialty Chemicals, Inc. Printed in U.S.A.
and Licensed trademarks of Hexion Specialty Chemicals, Inc. *Responsible Care is a registered service mark of the American Chemistry Council.
HEXION SPECIALTY CHEMICALS MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING ANY PRODUCT OR THE MERCHANTABILI TY OR FITNESS
THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION SPECIALTY CHEMICALS, except that the product
shall conform to contracted specifications, and that the product does not infringe any valid United States patent. The information provided herein was believed by
Hexion Specialty Chemicals to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the
user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product
and to determine the suitability of the product for its intended use.